
DRAM MODIL
Twouve nan 2008, konpayi gwoup nou an te nan zòn OEM flash memwa prèske 15 ane, OEM DRAM Modil, OEM SSD, OEM USB FLASH DRIVE, OEM TF KAT, kòm yon founisè pwofesyonèl OEM flash memwa, Nou konsantre nan ofri sèvis nan gwo kliyan mak. , komèsan prensipal ak distribitè peyi. Pou pi byen sipòte komèsan ak distribitè peyi yo, nou gen machandiz regilye pare tou de nan Hong Kong ak Shenzhen, nou vann plis pase 1 milyon pcs chak mwa.
Nou sitou sipòte DDR3, DDR4 pou kliyan ki tou fè biznis SSD, nan kliyan mak oswa faktori òdinatè, nou menm tou nou gen LPDDR ki kounye a sèlman sipòte Lachin Inland gwo telefòn mobil ak kliyan IPAD ak kèk kliyan gade entelijan. Avèk pèfòmans segondè li yo ak pi ba konsomasyon, li bon pou ti aparèy entelijan gwosè.
Dram/LPDDR paramèt teknik:
KATEGORI PWODWI | SPESIFIKASYON / | DANSITE | PAKÈ | Opere |
DRAM | DRAM D3 | 2Gb / 4Gb | FBGA 96 boul | 25 degre ~ 85 degre |
DRAM D4 | 4Gb / 8Gb | FBGA 96 boul | ||
Modil DRAM | U-DIMM | 4GB / 8GB / 16GB / 32GB | / | 0 degre - 85 degre |
SO-DIMM | ||||
R-DIMM | 8GB/16GB/32GB | / | 0 degre - 85 degre | |
LPDDR | LP DDR4 | 2GB / 3GB / 4GB / 6GB / 8GB | 200boul | 0 degre - 70 degre |
Espesifikasyon:
Modèl pwodwi No. | Spesifikasyon | Dansite | Dimansyon | Pake |
DRAM U-DIMM | 8GB X8/X16 | 8GB | 7.5 x 13.3mm | 78Boul/96Boul |
DRAM U-DIMM | 16GB X8/X16 | 16GB | 10.3 x 11mm | 78Boul/96Boul |
DRAM U-DIMM | 32GB X8/X16 | 32GB | 10.3 x 11mm | 78Boul/96Boul |
Modil ki disponib:
Nimewo Pati 1) | Dansite | Òganizasyon | Konpozisyon konpozan | Nimewo nan | Wotè |
UDIMM 4GB | 4GB | 512Mx64 | 512Mx16 * 4 | 1 | 31.25 mm |
8GB UDIMM | 8GB | 1Gx64 | 1Gx8 * 8 | 1 | 31.25 mm |
16GB UDIMM | 16GB | 2Gx64 | 1Gx8 * 16 | 2 | 31.25 mm |
4GB SODIMM | 4GB | 512Mx64 | 512Mx16 * 4 | 1 | 30 mm |
8GB SODIMM | 8GB | 1Gx64 | 1Gx8 * 8 | 1 | 30 mm |
16GB SODIMM | 16GB | 2Gx64 | 1Gx8 * 16 | 2 | 30 mm |
REMAK:
1) (2133Mbps 15-15-15) / (2400Mbps 17-17-17) / (2666Mbps 19-19-19) / (3200Mbps 22-22-22) / (3200 Mbps 16-18-18) - DDR{ {12}}(3200Mbps 16-18-18) konpatib pou pi ba frekans.
Karakteristik KLE
Vitès | DDR4-2133 | DDR4-2400 | DDR4-2666 | DDR4-3200 | DDR4-3200 | DDR4-3200 | Inite |
15-15-15 | 17-17-17 | 19-19-19 | 22-22-22 | 19-19-19 | 16-18-18 | ||
tCK (min) | 0.938 | 0.833 | 0.75 | 0.625 | 0.625 | 0.625 | ns |
Latansi CAS | 15 | 17 | 19 | 22 | 19 | 16 | nCK |
tRCD(min) | 14.06 | 14.16 | 14.25 | 13.75 | 11.875 | 11.25 | ns |
tRP (min) | 14.06 | 14.16 | 14.25 | 13.75 | 11.875 | 11.25 | ns |
tRAS(min) | 33 | 32 | 32 | 32.5 | 30.0 | 22.5 | ns |
tRC(min) | 47.06 | 46.16 | 46.25 | 46.25 | 41.875 | 33.75 | ns |
●JEDEC estanda 1.2V ± 0.06V Power Supply
●VDDQ= 1.2V ± 0.06 V
●1067MHz fCKpou 2133Mb/sec/pin, 1200MHz fCKpou 2400Mb/sec/PIN 1333MHz fCK pou 2666Mb/sec/PIN, 1600MHz fCK pou 3200Mb/sec/PIN
●16 Bank (4 gwoup Bank)
●Programmable CAS Latansi: 10,11,12,13,14,15,16,17,18,19,20,21, 22
●Latansi aditif pwogramab (CAS ki afiche): 0, CL - 2, oswa CL - 1 revèy
●Latansi Ekri CAS Programmable (CWL)=11,14 (DDR4-2133), 12,16 (DDR4-2400) ak 14,18 (DDR4- 2666) • Longè pete : 8, 4 ak tCCD=4 ki pa pèmèt li oswa ekri san pwoblèm [swa Sou vole lè l sèvi avèk A12 oswa MRS]
●Bi-direksyon Diferans Done Strobe
●On revokasyon mouri lè l sèvi avèk ODT PIN
●Mwayèn Peryòd rafrechisman 7.8us nan pi ba apre TCASE 85C, 3.9us nan 85C < TCASE 95C
●Asynchrone Reyajiste
DYAGRAM BÒK FONKSYON POU:
4GB, 512M x 64Modil (Peple kòm 1rank nan x16DDR4 SDRAMs)

REMAK :
1) Sòf si yo note otreman, valè rezistans yo se 150Ω 5 pousan.
2) ZQ rezistans yo se 2400Ω 1 pousan. Pou tout lòt valè rezistans, al gade nan dyagram fil elektrik ki apwopriye a.
8GB,1Gx64Module (Peple kòm 1rank nan x 8DDR4 SDRAMs)

Baj popilè: dram modil, wholesale, pri, an gwo, OEM
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